S500 3D BGA Reballing Stencil CPU Logic Module BGA Reballing Repair Tool for iPhone 5 5S 6 6S 7G 7Plus 8 8P


Isaiah 55:8-9 John 3:16 Philippians 4:19
Type: Type A8 CPU
Price:
Sale priceR 324.93 Regular priceR 390.00
Stock:
Sold out
 
 

We offer a 7 day replacement guarantee on all items that arrive defective or damaged. View our full policy here.

 

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Description

Features:

High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard  for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
 
Specification:

Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
 
Package included:

1 x BGA Reballing Tool
 
Details pictures:







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