Qianli S400 3D BGA Reballing Stencil Power Logic Module BGA Reballing Repair Tool for iOS 5 5S 6 6S 7G 7Plus 8 8P


Isaiah 55:8-9 John 3:16 Philippians 4:19
Type: for iPHone 6s/6sp
Price:
Sale priceR 525.89 Regular priceR 640.00
Stock:
Sold out
 
 

We offer a 7 day replacement guarantee on all items that arrive defective or damaged. View our full policy here.

 

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Description

Features:

3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard  for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
 
Specification:

Type: for PHone 8/8p / for PHone 7/7p / for PHone 6s/6sp / for PHone 6/6p
 
Package included:

1 x BGA Reballing Tool
 
Details pictures:









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